EVATEC AG

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1784
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 13349
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 6122
 
  
 
B05B SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES 163
 
  
 
B25J MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES 157
 
  
 
B65G TRANSPORT OR STORAGE DEVICES, e.g. CONVEYERS FOR LOADING OR TIPPING; SHOP CONVEYER SYSTEMS; PNEUMATIC TUBE CONVEYERS 166
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
C30B SINGLE-CRYSTAL GROWTH 155
 
  
 
F04B POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS 161
 
  
 
F16L PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL169

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0250,099 FILM STRESS UNIFORMITY CONTROL BY RF COUPLING AND WAFER MOUNT WITH ADAPTED RF COUPLINGOct 13, 15Aug 31, 17[H01L]
2017/0175,247 SPUTTERING SOURCE ARRANGEMENT, SPUTTERING SYSTEM AND METHOD OF MANUFACTURING METAL-COATED PLATE-SHAPED SUBSTRATESDec 03, 14Jun 22, 17[C23C, H01J, H01L]
2017/0117,174 ELECTRO-STATIC CHUCK WITH RADIOFREQUENCY SHUNTJun 15, 15Apr 27, 17[H01L]
2016/0299,262 APPARATUS AND PROCESS FOR ANNEALING OF ANTI-FINGERPRINT COATINGSNov 13, 14Oct 13, 16[C23C, B05D, G02B]
2015/0228,530 PROCESSING ARRANGEMENT WITH TEMPERATURE CONDITIONING ARRANGEMENT AND METHOD OF PROCESSING A SUBSTRATEAug 22, 13Aug 13, 15[C23C, H01J, H01L]
2013/0220,802 RF SUBSTRATE BIAS WITH HIGH POWER IMPULSE MAGNETRON SPUTTERING (HIPIMS)Apr 10, 13Aug 29, 13[C23C]
2012/0031,749 REACTIVE SPUTTERING WITH MULTIPLE SPUTTER SOURCESApr 23, 10Feb 09, 12[C23C]
2009/0173,622 REACTIVE SPUTTERING WITH HIPIMSDec 05, 08Jul 09, 09[C23C]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9793144 Wafer holder and temperature conditioning arrangement and method of manufacturing a waferAug 30, 11Oct 17, 17[H01L]
9719177 In-situ conditioning for vacuum processing of polymer substratesOct 03, 11Aug 01, 17[C23C, H01J, C23F]
9694990 Transport and handing-over arrangement for disc-shaped substrates, vacuum treatment installation and method for manufacture treated substratesJun 13, 13Jul 04, 17[H01L, B65G, B25J]
9644261 Apparatus for sputtering and a method of fabricating a metallization structureFeb 17, 14May 09, 17[C23C, H01J, H01L]
9624572 Method of HIPIMS sputtering and HIPIMS sputter systemFeb 07, 14Apr 18, 17[C23C, H01J]
9627324 Apparatus and method for processing a substrateNov 17, 10Apr 18, 17[H01L]
9611537 Target shapingFeb 23, 11Apr 04, 17[C23C]
9607831 Method for depositing an aluminium nitride layerFeb 27, 15Mar 28, 17[H01L, C30B]
9593407 Direct liquid depositionOct 19, 12Mar 14, 17[C23C, B05B]
9587306 Method for producing a directional layer by cathode sputtering, and device for implementing the methodJan 02, 08Mar 07, 17[C23C, H01J, G11B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6783641 Vacuum treatment system and process for manufacturing workpiecesExpiredMar 07, 03Aug 31, 04[C23C]

Top Inventors for This Owner

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